One superconducting quantum system, engineered across every layer.
From chip to software, each design choice is weighed against its impact on the whole stack. Shared openly, without proprietary detail.
Technology stack
Hardware first, with software connected to physical constraints.
The stack is presented at a capability level. Proprietary cell geometry, mask data, process assumptions and detailed control architecture remain within controlled technical review.
01 · Quantum processor
Superconducting device and microwave architecture
The processor programme coordinates qubit, coupling, resonator, readout and connectivity decisions while keeping proprietary geometry and process parameters controlled.
02 · Fabrication pathway
Layout discipline and foundry collaboration
Design intent is translated into reviewable layout data, process assumptions, test structures and acceptance criteria through controlled foundry workstreams.
03 · Package and cryogenics
The environment around the die
Packaging, shielding, thermalisation, interconnects and cryogenic integration are treated as first-order system constraints rather than downstream assembly tasks.
04 · Control and readout
Microwave signal delivery and acquisition
The control layer covers the interfaces required to generate, route, condition and recover signals with bounded latency, noise and channel interaction.
05 · Characterisation and calibration
Turning a fabricated device into an operable processor
Measurement and calibration workflows are designed to convert raw device behaviour into reproducible operating knowledge and updated engineering models.
06 · Compiler and runtime interfaces
Mapping workloads to physical constraints
Compilation and runtime research connects circuits to declared topology, gate, scheduling, noise and control constraints without overstating physical execution capability.
07 · Tvarit
Digital engineering and model refinement
Tvarit supports circuit analysis, architecture mapping, simulation, resource projection and evidence-labelled reporting. It enables the SQPU programme; it is not a substitute for measured QPU execution.
Digital analysis informs the hardware loop; physical evidence updates the models. Neither is credible without the other.
01
Design
Define the public-safe architecture basis, system interfaces, risks and acceptance criteria.
02
Model
Evaluate assumptions through simulation, imported engineering data and declared reference profiles.
03
Fabricate
Advance controlled layouts and test structures through an agreed foundry pathway.
04
Integrate
Package, thermalise and connect the device to the control and measurement stack.
05
Measure
Characterise physical behaviour under recorded configurations and test conditions.
06
Calibrate
Establish repeatable operation and quantify remaining constraints and uncertainty.
07
Refine
Reconcile measured data with models before increasing scale or changing the architecture.
Layer 07 · Tvarit digital engineering
The layer that keeps the other six honest.
Hardware decisions are expensive to reverse. Tvarit is where architecture and circuit assumptions are evaluated before a mask is committed, where every output carries its evidence class, and where measured results are reconciled against what was predicted. It supports the SQPU programme rather than standing in for it — and it is not presented as physical SQPU256 execution.
Before fabrication
Compare architecture options, mapping consequences and resource implications while changing a decision still costs nothing.
During review
Produce bounded, evidence-labelled reports that a foundry, laboratory or technical reviewer can interrogate line by line.
After measurement
Reconcile predicted against measured behaviour, record the delta, and carry the corrected model into the next design stage.
